Cutting: cutting the raw materials and auxiliary materials of the flexible circuit board FPC in a roll shape according to the Work size of each model
Drill: in order to conduct the layers of FPC products with double-sided and multi-layer structure, Through Hole is processed
Copper Gold Plating: In order to realize the conduction of the non-conductor area on the inner wall of the Through Hole, the flexible circuit board FPC is plated with gold by using Chemical to realize the conduction.
DF LAMI: in order to form a circuit, a flexible circuit board FPC is attached with a photosensitive film that can be hardened under UV light.
Exposure: to irradiate the FPC flexible circuit board with photosensitive Film with UV light of Mask film or directly irradiate Laser of LDI to form a Pattern Image
DES: removing the UV photosensitive film on the FPC flexible circuit board substrate after exposure and Etching the developed part of copper Cu with Etching liquid to form an FPC circuit
AOI: Use automatic and optical equipment to check the Pattern of the inner and outer layers of the formed circuit for unqualified Nick, short/open, etc.
Tack welding: temporary bonding of Coverlay and Adhesive of reinforcement table by heat.
HOT PRESS: After the products subjected to tack welding are laminated with normalized auxiliary materials, the products and Coverlay are pressurized with high temperature and high pressure.
Post-processing: processing with Auto Punch M/C to generate Guide Hole
Gold plating on the surface: in order to adhere the components to Connetor and Land, a surface treatment process (Gold, Tin) is carried out on the FPC of the flexible circuit board
Printing: The process of printing FPC flexible circuit board with ink in order to indicate product typesetting or marking.
STIFF: According to the characteristics of flexible circuit board FPCB, the product itself is soft. According to different requirements, reinforcing sheets, Tape, etc. are attached to the connection part or the attached part.
BBT: Use BBT Fixture to detect whether there is any abnormality in the electrical function of FPC flexible circuit board (short/open circuit, open circuit, etc.)
PRESS: Use mold to process the appearance of auxiliary materials and products
SMT: Process of Assembling Component to Complete FPCB
Final factory inspection: use microscope and magnifying glass to conduct FPC appearance inspection on the finished product, and confirm whether the product specifications and operation standards are consistent according to the standards of the customer company.
Packaging Factory Inspection: Confirm the quantity of completed FPC flexible circuit board products, reconstruct them in Lot units and package them in Box units, so as to ensure the provision of independently packaged products to customer companies.
All enterprises are paying attention to technology and quality. For Jingguanying, Quality and technology are not the "objects" to be promoted. They are the embodiment of Jingguanying's "future value vision". Jingguanying's FPC production promises customers the quality of its products. The quality of Jingguanying technology has not only been recognized in the domestic market, but also has received attention in the global market. Jingguanying technology is becoming the leader of FPCB industry. In the future, Jingguanying will also develop into a leading global enterprise in FPCB industry market based on excellent human resources, top production facilities and leading quality competitiveness.
Single Side FPC
Single Side FPC is the most basic form of Flexible PCB, which is a Type of circuit formed by conductive copper foil or aluminum on a single-sided substrate Film. It is usually used as Cable connecting equipment and equipment and Sub Board connecting Main Board.
ITEMS | SPEC |
Base Materials | Polyimide or Polyester |
Cover-lay | Polyimide, Solder Mask |
Thickness | 50㎛ ~ 125㎛ |
Line Width/Space | Normal Min. 0.040 / 0.040mm |
Conductor | 1/4oz, 1/3oz, 1/2oz |
Finish Plating | ENIG, Direct Gold,Soft Gold, Hard Gold, OSP, Immersion Tin |
Stiffener | PI, Epoxy |
Double Side FPC
Copper foil is used to form the circuit on both sides of Base Film, and Via Hole is used to form the most common FPC flexible circuit board on both sides of the circuit. For almost all electronic products, Fine Pattern technology, Hot Press technology, surface treatment and other technologies are required. The main uses include Mobile's Main Board's expanded Sub Board and LCD Module.
ITEMS | SPEC |
Min. Line/Space(out) | Normal : 50㎛ / 50㎛ , Special 40㎛ / 40㎛ |
Min. Hole Size | Mechanical : 0.15Ø, Special : 0.10Ø |
Stiffener | Polyimide, Epoxy, SUS |
Finish Plating | ENEPIG, Complex Suface Treatment, |
High ductility ENEPIG, Soft Gold | |
Hard Gold, Immersion TIN | |
Stiffener | PI, Epoxy |
Multi layer FPC
Multilayer FPC refers to FPC products with more than 3 layers of flexible circuit boards. With the trend of high function and high density of electronic technology, Fine Pattern and Laser Via Hole etc. are becoming thinner and shorter. The application level of Main Board for general mobile products and Touch Screen Board has gradually improved.
ITEMS | SPEC |
Layer | Over 3 Layer |
Min. Line/Space (out) | Normal : 60㎛㎛/ 60㎛, Special 50㎛㎛/ 50㎛ |
Min. Hole Size | Mechanical : 0.15Ø, Special : 0.10Ø |
Laser : 0.12Ø, Special 0.08Ø | |
Stiffener | Polyimide, Epoxy, SUS |
Surface Finish | ENEPIG, Complex Suface Treatment, High |
ductility ENEPIG, Soft Gold | |
Hard Gold |
RFPCB 软硬结合板
Rigid flexible PCB that gives all the advantages of Hard PCB and Flexible PCB. In order to realize the thinness and smallness of Connector connection between Board, the PCB is integrated. At present, it is usually used for Camera Module and also for integrated Main Board. Laserwia holeprocess is widely used.
ITEMS | SPEC |
Layer | Normaly 4 Layer |
Flatness | Under 8M : 30㎛, Over 8M : 20㎛㎛ |
Min. Hole Size | Mechanical : 0.15Ø, Special : 0.10Ø |
Laser : 0.12Ø, Special 0.08Ø | |
Impedance | Differential : 100 ± 10% |
Single : 50Ω ± 20% | |
PSR | Color : Blue, Black, Green |
Gloss : Matt, Glossy | |
Stiffener | Polyimide, Epoxy, SUS |
Surface Finish | ENEPIG, Complex Suface Treatment, |
High ductility ENEPIG, Soft Gold, Hard Gold |
产品特点:FPC柔性线路板 1.可自由弯曲、折叠、卷绕,可在三维空间随意移动及伸缩。 2.散热性能好,可利用F-PC缩小体积。 3.实现轻量化、小型化、薄型化,从而达到元件装置和导线连接一体化。 深圳市精莞盈电子有限公司专业设计生产各种FPC,FPCB,柔性线路板,可挠性印刷线路板,软性线路板,柔性印刷线路板,软硬结合板,柔性电路板等产品。
型 号:FPC-SX-006
层 数:2层
板 厚:0.15mm
材 料:1/2OZ有胶压延
铜 厚:1OZ
表面处理:沉金
最小线宽/线距:0.15mm/0.11mm
PI补强厚度:0.2MM
其 他:需贴胶纸 PI补强